materials project

Raspberry pi B+/B2

This is a case for the raspberry pi B+ and 2B. This case comes with the option of having a fan included for extra cooling. It has a foam spacer for added protection of the components, and a acrylic top and bottom so the components are visible. 7$ without no fan, 12$ with fan. Raspberry PI not included

young's modulus

PLA

Density 1.25 g/cm3 (78 lb/ft3)

Elastic (Young's, Tensile) Modulus 3.5 GPa (0.51 x 106 psi)

Elongation at Break 6 %

Flexural Modulus 4 GPa (0.6 x 106 psi)

Flexural Strength 80 MPa (12 x 103 psi)

Glass Transition Temperature 60 °C (140 °F)

Heat Deflection Temperature: At 455 kPa (66 psi)65 °C (150 °F)

Melting Onset (Solidus)160 °C (320 °F)

Shear Modulus 2.4 GPa (0.35 106 psi)

Specific Heat Capacity 1800 J/kg-K

Strength to Weight Ratio 40 kN-m/kg

Tensile Strength: Ultimate (UTS) 50 MPa (7.3 x 103 psi)

Thermal Conductivity 0.13 W/m-K

Polystyrene

Density 1.04 g/cm 3 (65 lb/ft3)

Dielectric Strength (Breakdown Potential)18 kV/mm (0.7 V/mil)

Elastic (Young's, Tensile) Modulus 1.9 GPa(0.28 x 106 psi)

Electrical Resistivity Order of Magnitude 14 10x Ω-m

Elongation at Break 40 %

Flexural Strength 62 MPa (9.0 x 103 psi)

Glass Transition Temperature 100 °C (210 °F)

Limiting Oxygen Index (LOI) 18 %

Specific Heat Capacity 1400 J/kg-K

Strength to Weight Ratio 31 kN-m/kg

Tensile Strength: Ultimate (UTS)32 MPa (4.6 x 103 psi)

Thermal Conductivity 0.22 W/m-K

Thermal Expansion 80 µm/m-K

Vicat Softening Temperature 105 °C (220 °F)

Water Absorption: After 24 Hours 0.08 %

ABS

Density1.03 to 1.38 g/cm3 (64 to 86 lb/ft3)

Dielectric Constant (Relative Permittivity)2.7 to 3.5

Dielectric Strength (Breakdown Potential)13 to 20 kV/mm (0.5 to 0.8 V/mil)

Elastic (Young's, Tensile) Modulus1.7 to 2.8 GPa (0.25 to 0.41 x 106 psi)

Electrical Resistivity Order of Magnitude13 10x Ω-m

Elongation at Break3 to 75 %

Flexural Modulus2.1 to 7.6 GPa (0.30 to 1.1 x 106 psi)

Flexural Strength69 to 97 MPa (10 to 14 x 103 psi)

Glass Transition Temperature100 °C (210 °F)

Heat Deflection Temperature: At 1.82 MPa (264 psi)76 to 109 °C (170 to 228 °F)

Heat Deflection Temperature: At 455 kPa (66 psi)84 to 118 °C (180 to 240 °F)

Specific Heat Capacity1080 to 1400 J/kg-K

Strength to Weight Ratio31 to 80 kN-m/kg

Tensile Strength: Ultimate (UTS)33 to 110 MPa (4.8 to 16 x 103 psi)

Thermal Expansion83 to 95 µm/m-K

Nylon

Density1.14 to 1.37 g/cm3 (71 to 86 lb/ft3)

Dielectric Constant (Relative Permittivity)3.2 to 15

Dielectric Strength (Breakdown Potential)25 to 30 kV/mm (1.0 to 1.2 V/mil)

Elastic (Young's, Tensile) Modulus1.6 to 23 GPa (0.2 to 3.3 x 106 psi)

Electrical Resistivity Order of Magnitude10 to 13 10x Ω-m

Elongation at Break3 to 60 %

Flexural Modulus1.3 to 19 GPa (0.19 to 2.8 x 106 psi)

Flexural Strength80 to 345 MPa (12 to 50 x 103 psi)

Glass Transition Temperature50 °C (120 °F)

Limiting Oxygen Index (LOI)26 %

Melting Onset (Solidus)260 °C (500 °F)

Strength to Weight Ratio53 to 189 kN-m/kg

Tensile Strength: Ultimate (UTS)60 to 240 MPa (8.7 to 35 x 103 psi)

Thermal Expansion23 to 72 µm/m-K

Water Absorption: After 24 Hours1.2 to 1.4 %

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